Solder Shape Prediction and Residual Stress Evaluation of BGA Solder Joint.
نویسندگان
چکیده
منابع مشابه
Study of micro-BGA solder joint reliability
A new re¯ow parameter, heating factor (Q g), which is de®ned as the integral of the measured temperature over the dwell time above liquidus, has been proposed in this report. It can suitably represent the combined eect of both temperature and time in usual re¯ow process. Relationship between reliability of the micro-ball grid array (micro-BGA) package and heating factor has been discussed. The...
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2001
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.4.581